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At ZS-IC we understand the essential role electronic components play in the functionality of your products. As an independent distributor in the electronics industry, it’s key for us that our customers have high-quality components ensuring their product life and availability.

In our ZS-IC QC Lab we support you with Quality and Counterfeit Analysis and offer various test methods including non-destructive and destructive testing.

Maximum Precision in Electronic Component Testing
Our Component Lab is equipped with cutting-edge technology and staffed by skilled experts. All our processes follow the various ISO certifications and compliance standards we have.  
Quality Analysis and Anti-counterfeit Inspection
Non-destructive testing
  • Radiological (X-ray) Analysis
  • X-ray Fluorescence for RoHS & Plating Analysis
Destructive testing
  • Decapsulation and Die Inspection
  • Wetting Balance / Dip & Look for Solderability Analysis
  • Surface Mount Simulation for BGA Ball Wetting Test
In addition, we offer some further 3rd party services including electrical testing, functional testing and Tape/Reel services.
1. Visual Inspection
Upon arrival, our QC specialists ensure that all packaging, labels and components conform with the original manufacture specifications including MPN number, date code, quantity and visual condition of all goods.
2. Photograph
The product is then transferred to our in-house QC area. Detailed photographic documentation starts, which includes checking further parameters such as the component's dimensions, the manufacturer's marking and bar code scan.
3. Top Marking
One of our main quality control is the marking verification by acetone and scrape test. When performed on a part that has been remarked, the top layer will be removed, revealing evidence of remarking. Through our verification test, we ensure that all component markings are consistent with the original manufacturer's specifications.
4. RoHS verification
XRF can be carried out in electronic parts to evaluate the material composition of the joints and the molding compound to detect the presence of prohibited substances such as Pb, variations within the batch, and other discrepancies with an authentic part.
5. X-ray

Widely considered a non-destructive test, X-ray inspection and analysis is a process used to verify the bond wire connections and die size comparison.

Besides the detailed X-ray images, our intelligence software can compare all X-ray images with each other and highlights any suspicious inconsistency.

6. Decapsulation Die inspection
By decapsulation of components, we are able to verify the die inside and read markings and validate if it's legit or not. For this process, we use a digital microscope with magnification up to ×1000, where even the smallest marking is well readable.
7. Pakage Well and Deliver to Customer